Siemens and TSMC deliver new certifications and design solutions for the foundry’s most advanced process technologies.

Synopsys, Inc. (Nasdaq: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips and electronic systems, today announced delivery of a comprehensive design ...

At the 2025 TSMC North America Open Innovation Platform Ecosystem Forum, Siemens Digital Industries Software announced ...

A research team has achieved a significant breakthrough in clean energy technology. The team has successfully enhanced a ...

Many industry trends are driving chip developers to consider multi-die designs using advanced 2.5D and 3D technologies. Such designs enable incorporating heterogeneous and homogeneous dies in a single ...

Day by day, technology continues to shrink while the transistor counts on chip increases, leading to greater design complexity. As a result, Metal ECO plays an important role in addressing last-minute ...

Collaboration with Siemens illustrates TSMC's persistent focus to enable shared customers for the latest and most advanced ...