Researchers from Penn State have demonstrated a novel method of 3D integration using 2D materials. This advancement, detailed in their recent study, addresses the growing challenge of fitting more ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Nisshinbo Micro Devices Inc. (Head office: Tokyo; President: Keiichi Yoshioka), has successfully achieved three-dimensional (3D) ...
It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...
Purdue faculty dedicate countless hours to exploring the frontiers of their respective fields, pushing the boundaries of knowledge and contributing to the ever-evolving landscape of academia. To ...
Contributing editor Françoise Von Trap writes about 3D technology and packaging in Electronic Design's 2010 Forecast issue and highlights some of the research going on with TSV (through-silicon via) ...
A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, ...
SAN JOSE, Calif.—Quanergy Solutions, a provider of 3D LiDAR solutions, has announced the integration of its Q-Track 3D LiDAR platform with Axis Communications’ VAPIX network video API. This ...
A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers at CERN, IZM Fraunhofer and University of Geneva. “Particle tracking and ...
In recent years, 3D printing has enjoyed a high media profile. The process actually refers to a raft of technologies that operate according to different physical and chemical principles and ...
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