Other markets include a hodgepodge of often ineffective approaches, but changes are coming as the value of connected assets ...

Mission-critical applications involve higher levels of abstraction than automotive and often need to meet safety-critical ...

Degradation in older chips can create new vulnerabilities; dealing with them involves some complex tradeoffs. The longer a ...

SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing ...

AI chips and data center communications see big funding; 75 startups raise $2 billion. The first quarter of 2025 saw six ...

Neuro-synaptic RAM; 3D photonic-electronic data link; complex memory management.

More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; ...

Semiconductor verification is changing to integrate AI with human expertise.

The founders of EDA are retiring, and perhaps it’s time that EDA headed off in a different direction.

L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...

A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...