More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

A new technical paper titled “Analyzing Modern NVIDIA GPU cores” was published by Universitat Politècnica de Catalunya.

Unveiling GPU Bottlenecks in Large-Batch LLM Inference” was published by researchers at Barcelona Supercomputing Center, ...

A new technical paper titled “Synaptic and neural behaviours in a standard silicon transistor” was published by researchers ...

A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...

L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...

Semiconductor verification is changing to integrate AI with human expertise.

The chip industry is exploring multiple avenues for simplifying multi-die integration, but difficulties remain for optimizing ...

Number of designs that are late increases. Rapidly rising complexity is the leading cause, but tools, training, and workflows ...

Verifying the functionality of a full multi-chip system, including digital controllers, analog electrical, and photonic ...

The founders of EDA are retiring, and perhaps it’s time that EDA headed off in a different direction.

D materials in 3D transistors; electrochemical memristive mechanism; matching substrates for power electronics.