AI chips and data center communications see big funding; 75 startups raise $2 billion. The first quarter of 2025 saw six ...
SE: With all these thermal issues and growing complexity of these multi-die assemblies, are there new kinds of stress testing profiles or different types of tests? Or does do the current JEDEC ...
More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.
Neuro-synaptic RAM; 3D photonic-electronic data link; complex memory management.
Semiconductor verification is changing to integrate AI with human expertise.
A new technical paper titled “Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond ...
The founders of EDA are retiring, and perhaps it’s time that EDA headed off in a different direction.
A new technical paper titled “Analyzing Modern NVIDIA GPU cores” was published by Universitat Politècnica de Catalunya.
U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; ...
A new technical paper titled “Synaptic and neural behaviours in a standard silicon transistor” was published by researchers ...
Unveiling GPU Bottlenecks in Large-Batch LLM Inference” was published by researchers at Barcelona Supercomputing Center, ...
L-R: Cadence’s Young; Synopsys’ Stahl; Siemens’ Munsey; ChipAgents’ Wang; Theodore Wilson. SE: What is a digital twin in the ...
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