A form of reflow AI has been available for many years. It has now grown up and become more powerful. MAX tells us that AI is ...
Abstract: In recent years, power electronics packaging industry has tightened the tolerance criteria for acceptable solder void size to below 5% in the power packages. Vacuum reflow technology has ...
Institute for Integrated Radiation and Nuclear Science, Kyoto University, 2, Asashiro-Nishi, Kumatori-cho, Sennan-gun, Osaka 590-0494 Japan Institute for Materials Research, Tohoku University, 2-1 ...