Wafer breakage is the most serious impact of killer crystalline defects. About 0.1 to 0.2% of silicon wafers break. The ...
Hardware-based security; 3D-IC challenges, opportunities; resource-constrained graphics; silicon photonics; edge AI speech ...
Programmatic control, AI integration, and automated workflows for high-frequency design.
With the advancement in AI networks and low-power inference devices, such as DSPs and NPUs, the time is right for voice-based user interfaces.
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