A new technical paper titled “PPAC Driven Multi-die and Multi-technology Floorplanning” was published by Texas A&M University ...

A new technical paper titled “Benchmarking Ultra-Low-Power μNPUs” was published by researchers at Imperial College London and University of Cambridge. Abstract “Efficient on-device neural network (NN) ...

A new technical paper titled “Security Risks and Designs in the Connected Vehicle Ecosystem: In-Vehicle and Edge Platforms” was published by researchers at Università di Pisa, Ford Motor Company, MIT, ...

A new technical paper titled “Design of Energy-Efficient Cross-coupled Differential Photonic-SRAM (pSRAM) Bitcell for ...

Tariff questions, impact; Europe's chiplets focus; DARPA's quantum push; Intel 18A enters risk production; optical networking ...

Deploying GenAI on edge devices offers several compelling advantages, particularly in applications where real-time processing ...

Other markets include a hodgepodge of often ineffective approaches, but changes are coming as the value of connected assets ...

Distillation makes AI efficient, scalable, and deployable across resource-constrained devices. The rapid advancements in AI ...

The automotive world is experiencing a groundbreaking transformation, with technology and AI-driven innovation at its core.

An architecture that delivers progressively higher levels of functional integration and security can meet a variety of unique ...

Degradation in older chips can create new vulnerabilities; dealing with them involves some complex tradeoffs. The longer a ...

AI chips and data center communications see big funding; 75 startups raise $2 billion. The first quarter of 2025 saw six ...